简介
[Publisher description] A Landmark text thoroughly updated, including a new CD As digital devices continue to be produced at increasingly lower costs and with higher speeds, the need for effective electromagnetic compatibility (EMC) design practices has become more critical than ever to avoid unnecessary costs in bringing products into compliance with governmental regulations. The Second Edition of this landmark text has been thoroughly updated and revised to reflect these major developments that affect both academia and the electronics industry. Readers familiar with the First Edition will find much new material, including: * Latest U.S. and international regulatory requirements * PSpice used throughout the textbook to simulate EMC analysis solutions * Methods of designing for Signal Integrity * Fortran programs for the simulation of Crosstalk supplied on a CD * OrCAD(r) PSpice(r) Release 10.0 and Version 8 Demo Edition software supplied on a CD * The final chapter on System Design for EMC completely rewritten * The chapter on Crosstalk rewritten to simplify the mathematics Detailed, worked-out examples are now included throughout the text. In addition, review exercises are now included following the discussion of each important topic to help readers assess their grasp of the material. Several appendices are new to this edition including Phasor Analysis of Electric Circuits, The Electromagnetic Field Equations and Waves, Computer Codes for Calculating the Per-Unit-Length Parameters and Crosstalk of Multiconductor Transmission Lines, and a SPICE (PSPICE) tutorial. Now thoroughly updated, the Second Edition of Introduction to Electromagnetic Compatibility remains the textbook of choice for university/college EMC courses as well as a reference for EMC design engineers.
目录
Contents 9
Preface 19
1 Introduction to Electromagnetic Compatibility (EMC) 25
1.1 Aspects of EMC 27
1.2 History of EMC 34
1.3 Examples 36
1.4 Electrical Dimensions and Waves 38
1.5 Decibels and Common EMC Units 47
1.5.1 Power Loss in Cables 56
1.5.2 Signal Source Specification 61
Problems 67
References 72
2 EMC Requirements for Electronic Systems 73
2.1 Governmental Requirements 74
2.1.1 Requirements for Commercial Products Marketed in the United States 74
2.1.2 Requirements for Commercial Products Marketed outside the United States 79
2.1.3 Requirements for Military Products Marketed in the United States 84
2.1.4 Measurement of Emissions for Verification of Compliance 86
2.1.4.1 Radiated Emissions 88
2.1.4.2 Conducted Emissions 91
2.1.5 Typical Product Emissions 96
2.1.6 A Simple Example to Illustrate the Difficulty in Meeting the Regulatory Limits 102
2.2 Additional Product Requirements 103
2.2.1 Radiated Susceptibility (Immunity) 105
2.2.2 Conducted Susceptibility (Immunity) 105
2.2.3 Electrostatic Discharge (ESD) 105
2.2.4 Requirements for Commercial Aircraft 106
2.2.5 Requirements for Commercial Vehicles 106
2.3 Design Constraints for Products 106
2.4 Advantages of EMC Design 108
Problems 110
References 113
3 Signal Spectra\u2014the Relationship between the Time Domain and the Frequency Domain 115
3.1 Periodic Signals 115
3.1.1 The Fourier Series Representation of Periodic Signals 118
3.1.2 Response of Linear Systems to Periodic Input Signals 128
3.1.3 Important Computational Techniques 135
3.2 Spectra of Digital Waveforms 142
3.2.1 The Spectrum of Trapezoidal (Clock) Waveforms 142
3.2.2 Spectral Bounds for Trapezoidal Waveforms 146
3.2.2.1 Effect of Rise/Falltime on Spectral Content 147
3.2.2.2 Bandwidth of Digital Waveforms 156
3.2.2.3 Effect of Repetition Rate and Duty Cycle 160
3.2.2.4 Effect of Ringing (Undershoot/Overshoot) 161
3.2.3 Use of Spectral Bounds in Computing Bounds on the Output Spectrum of a Linear System 164
3.3 Spectrum Analyzers 166
3.3.1 Basic Principles 166
3.3.2 Peak versus Quasi-Peak versus Average 170
3.4 Representation of Nonperiodic Waveforms 172
3.4.1 The Fourier Transform 172
3.4.2 Response of Linear Systems to Nonperiodic Inputs 175
3.5 Representation of Random (Data) Signals 175
3.6 Use of SPICE (PSPICE) In Fourier Analysis 179
Problems 191
References 199
4 Transmission Lines and Signal Integrity 201
4.1 The Transmission-Line Equations 205
4.2 The Per-Unit-Length Parameters 208
4.2.1 Wire-Type Structures 210
4.2.2 Printed Circuit Board (PCB) Structures 223
4.3 The Time-Domain Solution 228
4.3.1 Graphical Solutions 228
4.3.2 The SPICE Model 242
4.4 High-Speed Digital Interconnects and Signal Integrity 249
4.4.1 Effect of Terminations on the Line Waveforms 254
4.4.1.1 Effect of Capacitive Terminations 257
4.4.1.2 Effect of Inductive Terminations 260
4.4.2 Matching Schemes for Signal Integrity 262
4.4.3 When Does the Line Not Matter, i.e., When is Matching Not Required? 268
4.4.4 Effects of Line Discontinuities 271
4.5 Sinusoidal Excitation of the Line and the Phasor Solution 284
4.5.1 Voltage and Current as Functions of Position 285
4.5.2 Power Flow 293
4.5.3 Inclusion of Losses 294
4.5.4 Effect of Losses on Signal Integrity 297
4.6 Lumped-Circuit Approximate Models 307
Problems 311
References 321
5 Nonideal Behavior of Components 323
5.1 Wires 324
5.1.1 Resistance and Internal Inductance of Wires 328
5.1.2 External Inductance and Capacitance of Parallel Wires 332
5.1.3 Lumped Equivalent Circuits of Parallel Wires 333
5.2 Printed Circuit Board (PCB) Lands 336
5.3 Effect of Component Leads 339
5.4 Resistors 341
5.5 Capacitors 349
5.6 Inductors 360
5.7 Ferromagnetic Materials\u2014Saturation and Frequency Response 364
5.8 Ferrite Beads 367
5.9 Common-Mode Chokes 370
5.10 Electromechanical Devices 376
5.10.1 DC Motors 376
5.10.2 Stepper Motors 379
5.10.3 AC Motors 379
5.10.4 Solenoids 380
5.11 Digital Circuit Devices 381
5.12 Effect of Component Variability 382
5.13 Mechanical Switches 383
5.13.1 Arcing at Switch Contacts 384
5.13.2 The Showering Arc 387
5.13.3 Arc Suppression 388
Problems 393
References 399
6 Conducted Emissions and Susceptibility 401
6.1 Measurement of Conducted Emissions 402
6.1.1 The Line Impedance Stabilization Network (LISN) 403
6.1.2 Common- and Differential-Mode Currents Again 405
6.2 Power Supply Filters 409
6.2.1 Basic Properties of Filters 409
6.2.2 A Generic Power Supply Filter Topology 412
6.2.3 Effect of Filter Elements on Common- and Differential-Mode Currents 414
6.2.4 Separation of Conducted Emissions into Common- and Differential-Mode Components for Diagnostic Purposes 420
6.3 Power Supplies 425
6.3.1 Linear Power Supplies 429
6.3.2 Switched-Mode Power Supplies (SMPS) 430
6.3.3 Effect of Power Supply Components on Conducted Emissions 433
6.4 Power Supply and Filter Placement 438
6.5 Conducted Susceptibility 440
Problems 440
References 443
7 Antennas 445
7.1 Elemental Dipole Antennas 445
7.1.1 The Electric (Hertzian) Dipole 446
7.1.2 The Magnetic Dipole (Loop) 450
7.2 The Half-Wave Dipole and Quarter-Wave Monopole Antennas 453
7.3 Antenna Arrays 464
7.4 Characterization of Antennas 472
7.4.1 Directivity and Gain 472
7.4.2 Effective Aperture 478
7.4.3 Antenna Factor 480
7.4.4 Effects of Balancing and Baluns 484
7.4.5 Impedance Matching and the Use of Pads 487
7.5 The Friis Transmission Equation 490
7.6 Effects of Reflections 494
7.6.1 The Method of Images 494
7.6.2 Normal Incidence of Uniform Plane Waves on Plane, Material Boundaries 494
7.6.3 Multipath Effects 503
7.7 Broadband Measurment Antennas 510
7.7.1 The Biconical Antenna 511
7.7.2 The Log-Periodic Antenna 514
Problems 518
References 525
8 Radiated Emissions and Susceptibility 527
8.1 Simple Emission Models for Wires and PCB Lands 528
8.1.1 Differential-Mode versus Common-Mode Currents 528
8.1.2 Differential-Mode Current Emission Model 533
8.1.3 Common-Mode Current Emission Model 538
8.1.4 Current Probes 542
8.1.5 Experimental Results 547
8.2 Simple Susceptibility Models for Wires and PCB Lands 557
8.2.1 Experimental Results 568
8.2.2 Shielded Cables and Surface Transfer Impedance 570
Problems 574
References 580
9 Crosstalk 583
9.1 Three-Conductor Transmission Lines and Crosstalk 584
9.2 The Transmission-Line Equations for Lossless Lines 588
9.3 The Per-Unit-Length Parameters 591
9.3.1 Homogeneous versus Inhomogeneous Media 592
9.3.2 Wide-Separation Approximations for Wires 594
9.3.3 Numerical Methods for Other Structures 604
9.3.3.1 Wires with Dielectric Insulations (Ribbon Cables) 610
9.3.3.2 Rectangular Cross-Section Conductors (PCB Lands) 614
9.4 The Inductive\u2013Capacitive Coupling Approximate Model 619
9.4.1 Frequency-Domain Inductive-Capacitive Coupling Model 623
9.4.1.1 Inclusion of Losses: Common-Impedance Coupling 625
9.4.1.2 Experimental Results 628
9.4.2 Time-Domain Inductive\u2013Capacitive Coupling Model 636
9.4.2.1 Inclusion of Losses: Common-Impedance Coupling 640
9.4.2.2 Experimental Results 641
9.5 Lumped-Circuit Approximate Models 648
9.6 An Exact SPICE (PSPICE) Model for Lossless, Coupled Lines 648
9.6.1 Computed versus Experimental Results for Wires 657
9.6.2 Computed versus Experimental Results for PCBs 664
9.7 Shielded Wires 671
9.7.1 Per-Unit-Length Parameters 672
9.7.2 Inductive and Capacitive Coupling 675
9.7.3 Effect of Shield Grounding 682
9.7.4 Effect of Pigtails 691
9.7.5 Effects of Multiple Shields 693
9.7.6 MTL Model Predictions 699
9.8 Twisted Wires 701
9.8.1 Per-Unit-Length Parameters 705
9.8.2 Inductive and Capacitive Coupling 709
9.8.3 Effects of Twist 713
9.8.4 Effects of Balancing 722
Problems 725
References 734
10 Shielding 737
10.1 Shielding Effectiveness 742
10.2 Shielding Effectiveness: Far-Field Sources 745
10.2.1 Exact Solution 745
10.2.2 Approximate Solution 749
10.2.2.1 Reflection Loss 749
10.2.2.2 Absorption Loss 752
10.2.2.3 Multiple-Reflection Loss 753
10.2.2.4 Total Loss 755
10.3 Shielding Effectiveness: Near-Field Sources 759
10.3.1 Near Field versus Far Field 760
10.3.2 Electric Sources 764
10.3.3 Magnetic Sources 764
10.4 Low-Frequency, Magnetic Field Shielding 766
10.5 Effect of Apertures 769
Problems 774
References 775
11 System Design for EMC 777
11.1 Changing the Way We Think about Electrical Phenomena 782
11.1.1 Nonideal Behavior of Components and the Hidden Schematic 782
11.1.2 \u201cElectrons Do Not Read Schematics\u201d 787
11.1.3 What Do We Mean by the Term \u201cShielding\u201d? 790
11.2 What Do We Mean by the Term \u201cGround\u201d? 792
11.2.1 Safety Ground 795
11.2.2 Signal Ground 798
11.2.3 Ground Bounce and Partial Inductance 799
11.2.3.1 Partial Inductance of Wires 805
11.2.3.2 Partial Inductance of PCB Lands 810
11.2.4 Currents Return to Their Source on the Paths of Lowest Impedance 811
11.2.5 Utilizing Mutual Inductance and Image Planes to Force Currents to Return on a Desired Path 817
11.2.6 Single-Point Grounding, Multipoint Grounding, and Hybrid Grounding 820
11.2.7 Ground Loops and Subsystem Decoupling 826
11.3 Printed Circuit Board (PCB) Design 829
11.3.1 Component Selection 829
11.3.2 Component Speed and Placement 830
11.3.3 Cable I/O Placement and Filtering 832
11.3.4 The Important Ground Grid 834
11.3.5 Power Distribution and Decoupling Capacitors 836
11.3.6 Reduction of Loop Areas 846
11.3.7 Mixed-Signal PCB Partitioning 847
11.4 System Configuration and Design 851
11.4.1 System Enclosures 851
11.4.2 Power Line Filter Placement 852
11.4.3 Interconnection and Number of Printed Circuit Boards 853
11.4.4 Internal Cable Routing and Connector Placement 855
11.4.5 PCB and Subsystem Placement 856
11.4.6 PCB and Subsystem Decoupling 856
11.4.7 Motor Noise Suppression 856
11.4.8 Electrostatic Discharge (ESD) 858
11.5 Diagnostic Tools 871
11.5.1 The Concept of Dominant Effect in the Diagnosis of EMC Problems 874
Problem 880
References 881
Appendix A The Phasor Solution Method 883
A.1 Solving Differential Equations for Their Sinusoidal, Steady-State Solution 883
A.2 Solving Electric Circuits for Their Sinusoidal, Steady-State Response 887
Problems 891
References 893
Appendix B The Electromagnetic Field Equations and Waves 895
B.1 Vector Analysis 896
B.2 Maxwell\u2019s Equations 905
B.2.1 Faraday\u2019s Law 905
B.2.2 Ampere\u2019s Law 916
B.2.3 Gauss\u2019 Laws 922
B.2.4 Conservation of Charge 924
B.2.5 Constitutive Parameters of the Medium 924
B.3 Boundary Conditions 926
B.4 Sinusoidal Steady State 931
B.5 Power Flow 933
B.6 Uniform Plane Waves 933
B.6.1 Lossless Media 936
B.6.2 Lossy Media 942
B.6.3 Power Flow 946
B.6.4 Conductors versus Dielectrics 947
B.6.5 Skin Depth 949
B.7 Static (DC) Electromagnetic Field Relations\u2014a Special Case 951
B.7.1 Maxwell\u2019s Equations for Static (DC) Fields 951
B.7.1.1 Range of Applicability for Low-Frequency Fields 952
B.7.2 Two-Dimensional Fields and Laplace\u2019s Equation 952
Problems 954
References 963
Appendix C Computer Codes for Calculating the Per-Unit-Length (PUL) Parameters and Crosstalk of Multiconductor Transmission Lines 965
C.1 WIDESEP.FOR for Computing the PUL Parameter Matrices of Widely Spaced Wires 966
C.2 RIBBON.FOR for Computing the PUL Parameter Matrices of Ribbon Cables 971
C.3 PCB.FOR for Computing the PUL Parameter Matrices of Printed Circuit Boards 973
C.4 MSTRP.FOR for Computing the PUL Parameter Matrices of Coupled Microstrip Lines 975
C.5 STRPLINE.FOR for Computing the PUL Parameter Matrices of Coupled Striplines 976
C.6 SPICEMTL.FOR for Computing a SPICE (PSPICE) Subcircuit Model of a Lossless, Multiconductor Transmission Line 978
C.7 SPICELPI.FOR For Computing a SPICE (PSPICE) Subcircuit of a Lumped-Pi Model of a Lossless, Multiconductor Transmission Line 980
Appendix D A SPICE (PSPICE) Tutorial 983
D.1 Creating the SPICE or PSPICE Program 984
D.2 Circuit Description 985
D.3 Execution Statements 991
D.4 Output Statements 992
D.5 Examples 994
References 998
Index 999
Preface 19
1 Introduction to Electromagnetic Compatibility (EMC) 25
1.1 Aspects of EMC 27
1.2 History of EMC 34
1.3 Examples 36
1.4 Electrical Dimensions and Waves 38
1.5 Decibels and Common EMC Units 47
1.5.1 Power Loss in Cables 56
1.5.2 Signal Source Specification 61
Problems 67
References 72
2 EMC Requirements for Electronic Systems 73
2.1 Governmental Requirements 74
2.1.1 Requirements for Commercial Products Marketed in the United States 74
2.1.2 Requirements for Commercial Products Marketed outside the United States 79
2.1.3 Requirements for Military Products Marketed in the United States 84
2.1.4 Measurement of Emissions for Verification of Compliance 86
2.1.4.1 Radiated Emissions 88
2.1.4.2 Conducted Emissions 91
2.1.5 Typical Product Emissions 96
2.1.6 A Simple Example to Illustrate the Difficulty in Meeting the Regulatory Limits 102
2.2 Additional Product Requirements 103
2.2.1 Radiated Susceptibility (Immunity) 105
2.2.2 Conducted Susceptibility (Immunity) 105
2.2.3 Electrostatic Discharge (ESD) 105
2.2.4 Requirements for Commercial Aircraft 106
2.2.5 Requirements for Commercial Vehicles 106
2.3 Design Constraints for Products 106
2.4 Advantages of EMC Design 108
Problems 110
References 113
3 Signal Spectra\u2014the Relationship between the Time Domain and the Frequency Domain 115
3.1 Periodic Signals 115
3.1.1 The Fourier Series Representation of Periodic Signals 118
3.1.2 Response of Linear Systems to Periodic Input Signals 128
3.1.3 Important Computational Techniques 135
3.2 Spectra of Digital Waveforms 142
3.2.1 The Spectrum of Trapezoidal (Clock) Waveforms 142
3.2.2 Spectral Bounds for Trapezoidal Waveforms 146
3.2.2.1 Effect of Rise/Falltime on Spectral Content 147
3.2.2.2 Bandwidth of Digital Waveforms 156
3.2.2.3 Effect of Repetition Rate and Duty Cycle 160
3.2.2.4 Effect of Ringing (Undershoot/Overshoot) 161
3.2.3 Use of Spectral Bounds in Computing Bounds on the Output Spectrum of a Linear System 164
3.3 Spectrum Analyzers 166
3.3.1 Basic Principles 166
3.3.2 Peak versus Quasi-Peak versus Average 170
3.4 Representation of Nonperiodic Waveforms 172
3.4.1 The Fourier Transform 172
3.4.2 Response of Linear Systems to Nonperiodic Inputs 175
3.5 Representation of Random (Data) Signals 175
3.6 Use of SPICE (PSPICE) In Fourier Analysis 179
Problems 191
References 199
4 Transmission Lines and Signal Integrity 201
4.1 The Transmission-Line Equations 205
4.2 The Per-Unit-Length Parameters 208
4.2.1 Wire-Type Structures 210
4.2.2 Printed Circuit Board (PCB) Structures 223
4.3 The Time-Domain Solution 228
4.3.1 Graphical Solutions 228
4.3.2 The SPICE Model 242
4.4 High-Speed Digital Interconnects and Signal Integrity 249
4.4.1 Effect of Terminations on the Line Waveforms 254
4.4.1.1 Effect of Capacitive Terminations 257
4.4.1.2 Effect of Inductive Terminations 260
4.4.2 Matching Schemes for Signal Integrity 262
4.4.3 When Does the Line Not Matter, i.e., When is Matching Not Required? 268
4.4.4 Effects of Line Discontinuities 271
4.5 Sinusoidal Excitation of the Line and the Phasor Solution 284
4.5.1 Voltage and Current as Functions of Position 285
4.5.2 Power Flow 293
4.5.3 Inclusion of Losses 294
4.5.4 Effect of Losses on Signal Integrity 297
4.6 Lumped-Circuit Approximate Models 307
Problems 311
References 321
5 Nonideal Behavior of Components 323
5.1 Wires 324
5.1.1 Resistance and Internal Inductance of Wires 328
5.1.2 External Inductance and Capacitance of Parallel Wires 332
5.1.3 Lumped Equivalent Circuits of Parallel Wires 333
5.2 Printed Circuit Board (PCB) Lands 336
5.3 Effect of Component Leads 339
5.4 Resistors 341
5.5 Capacitors 349
5.6 Inductors 360
5.7 Ferromagnetic Materials\u2014Saturation and Frequency Response 364
5.8 Ferrite Beads 367
5.9 Common-Mode Chokes 370
5.10 Electromechanical Devices 376
5.10.1 DC Motors 376
5.10.2 Stepper Motors 379
5.10.3 AC Motors 379
5.10.4 Solenoids 380
5.11 Digital Circuit Devices 381
5.12 Effect of Component Variability 382
5.13 Mechanical Switches 383
5.13.1 Arcing at Switch Contacts 384
5.13.2 The Showering Arc 387
5.13.3 Arc Suppression 388
Problems 393
References 399
6 Conducted Emissions and Susceptibility 401
6.1 Measurement of Conducted Emissions 402
6.1.1 The Line Impedance Stabilization Network (LISN) 403
6.1.2 Common- and Differential-Mode Currents Again 405
6.2 Power Supply Filters 409
6.2.1 Basic Properties of Filters 409
6.2.2 A Generic Power Supply Filter Topology 412
6.2.3 Effect of Filter Elements on Common- and Differential-Mode Currents 414
6.2.4 Separation of Conducted Emissions into Common- and Differential-Mode Components for Diagnostic Purposes 420
6.3 Power Supplies 425
6.3.1 Linear Power Supplies 429
6.3.2 Switched-Mode Power Supplies (SMPS) 430
6.3.3 Effect of Power Supply Components on Conducted Emissions 433
6.4 Power Supply and Filter Placement 438
6.5 Conducted Susceptibility 440
Problems 440
References 443
7 Antennas 445
7.1 Elemental Dipole Antennas 445
7.1.1 The Electric (Hertzian) Dipole 446
7.1.2 The Magnetic Dipole (Loop) 450
7.2 The Half-Wave Dipole and Quarter-Wave Monopole Antennas 453
7.3 Antenna Arrays 464
7.4 Characterization of Antennas 472
7.4.1 Directivity and Gain 472
7.4.2 Effective Aperture 478
7.4.3 Antenna Factor 480
7.4.4 Effects of Balancing and Baluns 484
7.4.5 Impedance Matching and the Use of Pads 487
7.5 The Friis Transmission Equation 490
7.6 Effects of Reflections 494
7.6.1 The Method of Images 494
7.6.2 Normal Incidence of Uniform Plane Waves on Plane, Material Boundaries 494
7.6.3 Multipath Effects 503
7.7 Broadband Measurment Antennas 510
7.7.1 The Biconical Antenna 511
7.7.2 The Log-Periodic Antenna 514
Problems 518
References 525
8 Radiated Emissions and Susceptibility 527
8.1 Simple Emission Models for Wires and PCB Lands 528
8.1.1 Differential-Mode versus Common-Mode Currents 528
8.1.2 Differential-Mode Current Emission Model 533
8.1.3 Common-Mode Current Emission Model 538
8.1.4 Current Probes 542
8.1.5 Experimental Results 547
8.2 Simple Susceptibility Models for Wires and PCB Lands 557
8.2.1 Experimental Results 568
8.2.2 Shielded Cables and Surface Transfer Impedance 570
Problems 574
References 580
9 Crosstalk 583
9.1 Three-Conductor Transmission Lines and Crosstalk 584
9.2 The Transmission-Line Equations for Lossless Lines 588
9.3 The Per-Unit-Length Parameters 591
9.3.1 Homogeneous versus Inhomogeneous Media 592
9.3.2 Wide-Separation Approximations for Wires 594
9.3.3 Numerical Methods for Other Structures 604
9.3.3.1 Wires with Dielectric Insulations (Ribbon Cables) 610
9.3.3.2 Rectangular Cross-Section Conductors (PCB Lands) 614
9.4 The Inductive\u2013Capacitive Coupling Approximate Model 619
9.4.1 Frequency-Domain Inductive-Capacitive Coupling Model 623
9.4.1.1 Inclusion of Losses: Common-Impedance Coupling 625
9.4.1.2 Experimental Results 628
9.4.2 Time-Domain Inductive\u2013Capacitive Coupling Model 636
9.4.2.1 Inclusion of Losses: Common-Impedance Coupling 640
9.4.2.2 Experimental Results 641
9.5 Lumped-Circuit Approximate Models 648
9.6 An Exact SPICE (PSPICE) Model for Lossless, Coupled Lines 648
9.6.1 Computed versus Experimental Results for Wires 657
9.6.2 Computed versus Experimental Results for PCBs 664
9.7 Shielded Wires 671
9.7.1 Per-Unit-Length Parameters 672
9.7.2 Inductive and Capacitive Coupling 675
9.7.3 Effect of Shield Grounding 682
9.7.4 Effect of Pigtails 691
9.7.5 Effects of Multiple Shields 693
9.7.6 MTL Model Predictions 699
9.8 Twisted Wires 701
9.8.1 Per-Unit-Length Parameters 705
9.8.2 Inductive and Capacitive Coupling 709
9.8.3 Effects of Twist 713
9.8.4 Effects of Balancing 722
Problems 725
References 734
10 Shielding 737
10.1 Shielding Effectiveness 742
10.2 Shielding Effectiveness: Far-Field Sources 745
10.2.1 Exact Solution 745
10.2.2 Approximate Solution 749
10.2.2.1 Reflection Loss 749
10.2.2.2 Absorption Loss 752
10.2.2.3 Multiple-Reflection Loss 753
10.2.2.4 Total Loss 755
10.3 Shielding Effectiveness: Near-Field Sources 759
10.3.1 Near Field versus Far Field 760
10.3.2 Electric Sources 764
10.3.3 Magnetic Sources 764
10.4 Low-Frequency, Magnetic Field Shielding 766
10.5 Effect of Apertures 769
Problems 774
References 775
11 System Design for EMC 777
11.1 Changing the Way We Think about Electrical Phenomena 782
11.1.1 Nonideal Behavior of Components and the Hidden Schematic 782
11.1.2 \u201cElectrons Do Not Read Schematics\u201d 787
11.1.3 What Do We Mean by the Term \u201cShielding\u201d? 790
11.2 What Do We Mean by the Term \u201cGround\u201d? 792
11.2.1 Safety Ground 795
11.2.2 Signal Ground 798
11.2.3 Ground Bounce and Partial Inductance 799
11.2.3.1 Partial Inductance of Wires 805
11.2.3.2 Partial Inductance of PCB Lands 810
11.2.4 Currents Return to Their Source on the Paths of Lowest Impedance 811
11.2.5 Utilizing Mutual Inductance and Image Planes to Force Currents to Return on a Desired Path 817
11.2.6 Single-Point Grounding, Multipoint Grounding, and Hybrid Grounding 820
11.2.7 Ground Loops and Subsystem Decoupling 826
11.3 Printed Circuit Board (PCB) Design 829
11.3.1 Component Selection 829
11.3.2 Component Speed and Placement 830
11.3.3 Cable I/O Placement and Filtering 832
11.3.4 The Important Ground Grid 834
11.3.5 Power Distribution and Decoupling Capacitors 836
11.3.6 Reduction of Loop Areas 846
11.3.7 Mixed-Signal PCB Partitioning 847
11.4 System Configuration and Design 851
11.4.1 System Enclosures 851
11.4.2 Power Line Filter Placement 852
11.4.3 Interconnection and Number of Printed Circuit Boards 853
11.4.4 Internal Cable Routing and Connector Placement 855
11.4.5 PCB and Subsystem Placement 856
11.4.6 PCB and Subsystem Decoupling 856
11.4.7 Motor Noise Suppression 856
11.4.8 Electrostatic Discharge (ESD) 858
11.5 Diagnostic Tools 871
11.5.1 The Concept of Dominant Effect in the Diagnosis of EMC Problems 874
Problem 880
References 881
Appendix A The Phasor Solution Method 883
A.1 Solving Differential Equations for Their Sinusoidal, Steady-State Solution 883
A.2 Solving Electric Circuits for Their Sinusoidal, Steady-State Response 887
Problems 891
References 893
Appendix B The Electromagnetic Field Equations and Waves 895
B.1 Vector Analysis 896
B.2 Maxwell\u2019s Equations 905
B.2.1 Faraday\u2019s Law 905
B.2.2 Ampere\u2019s Law 916
B.2.3 Gauss\u2019 Laws 922
B.2.4 Conservation of Charge 924
B.2.5 Constitutive Parameters of the Medium 924
B.3 Boundary Conditions 926
B.4 Sinusoidal Steady State 931
B.5 Power Flow 933
B.6 Uniform Plane Waves 933
B.6.1 Lossless Media 936
B.6.2 Lossy Media 942
B.6.3 Power Flow 946
B.6.4 Conductors versus Dielectrics 947
B.6.5 Skin Depth 949
B.7 Static (DC) Electromagnetic Field Relations\u2014a Special Case 951
B.7.1 Maxwell\u2019s Equations for Static (DC) Fields 951
B.7.1.1 Range of Applicability for Low-Frequency Fields 952
B.7.2 Two-Dimensional Fields and Laplace\u2019s Equation 952
Problems 954
References 963
Appendix C Computer Codes for Calculating the Per-Unit-Length (PUL) Parameters and Crosstalk of Multiconductor Transmission Lines 965
C.1 WIDESEP.FOR for Computing the PUL Parameter Matrices of Widely Spaced Wires 966
C.2 RIBBON.FOR for Computing the PUL Parameter Matrices of Ribbon Cables 971
C.3 PCB.FOR for Computing the PUL Parameter Matrices of Printed Circuit Boards 973
C.4 MSTRP.FOR for Computing the PUL Parameter Matrices of Coupled Microstrip Lines 975
C.5 STRPLINE.FOR for Computing the PUL Parameter Matrices of Coupled Striplines 976
C.6 SPICEMTL.FOR for Computing a SPICE (PSPICE) Subcircuit Model of a Lossless, Multiconductor Transmission Line 978
C.7 SPICELPI.FOR For Computing a SPICE (PSPICE) Subcircuit of a Lumped-Pi Model of a Lossless, Multiconductor Transmission Line 980
Appendix D A SPICE (PSPICE) Tutorial 983
D.1 Creating the SPICE or PSPICE Program 984
D.2 Circuit Description 985
D.3 Execution Statements 991
D.4 Output Statements 992
D.5 Examples 994
References 998
Index 999
- 名称
- 类型
- 大小
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