副标题:无

作   者:

分类号:

ISBN:9787111168690

微信扫一扫,移动浏览光盘

简介

  本书介绍了学习EDA所需的内容,从而揭开了这个高技术产业的神秘面纱。书中以友好、非正式的方式介绍EDA商业和技术,其内容对非专业读者足够清晰,对专业读者足够详细。本书面向EDA、半导体或相关产业中负责销售、市场、公关、法规、金融等的非技术人员,同时也可以作为VLSI设计中的交叉学科工程、商业和市场课程的优秀补充教材。     在本书中,经验丰富的产业领导者Mark Birnbaum简单而清晰地介绍了EDA要解决的设计问题、解决问题的工具、应用工具的设计者以及使得EDA成为电子产品和芯片设计关键的因素。另外,本书提供了供新入行者参考的丰富的附录,包括电子、半导体制造、计算和通用计量方面的入门资料、参考资源和完整的缩略语术语表。     本书的主要特点     ●解释EDA是如何适合电子产品和半导体产业的。     ●从工具使用者和EDA软件开发者的角度研究EDA产业,包括商业模型、投资回报和工具评   价。     ●包括定义IC作用的电子系统级工具、设计IC行为的前端功能性芯片级工具、实现IC物理布   局的后端设计工具。     ●讨论EDA产业的趋势和IC设计问题,包括深亚微米的挑战、知识产权和片上系统。     ●包括EDA标准组织和出版物。  

目录

preface iii

purpose of this book xv

intended audience xvi

organization xvii

acknowledgements xviii

chapter i introduction to eda 1

introduction 2

electronic products 2

printed circuit (pc) boards 2

integrated circuits 3

cad, cam, cae, and eda 4

data, signals, and input/output 5

electronic product development 5

eda party--users and tools 7

system design 8

logic design 9

asic design 10

physical layout design 11

eda benefits 15

summary 15

.chapter 2 the business of eda 17

introduction 18

eda user return on investment 20

eda vendor return on investment 22

eda tool development sources 23

in-house/out-source eda tool development 24

the time-to-market competition 25

ed,a, business models 28

new eda tools 29

licensing models 29

mergers and acquisitions 30

application service provider model 31

design services business 31

eda industry growth 32

relative industry sizes: eda, ic, electronics 32

relative risk factor 33

eda people and conferences 34

people opportunities 35

key conferences 35

summary 36

quick quiz 37

chapter 3 the user perspective 39

introduction 40

four key eda user decisions 40

organization 41

computer network 42

security requirements 44

computer systems 45

engineering / non-engineering goals 46

how to buy eda tools—five key issues 47

cost/performance 47

training and support 49

make or buy 50

compatibility 51

transition 51

standards efforts--who, what, and why 53

design flow integration 53

eda tool interface standards 55

frameworks 56

design database standards 56

standards groups 57

personnel--the key to eda support 57

university connections 58

summary 60

quick quiz 60

chapter 4 overview of eda tools and design concepts 63

introduction 64

tool improvements 64

major classes of eda tools 65

electronic system-level design tools 66

front-end design tools 67

back-end design tools 68

essential eda concepts 70

design views 70

design data 71

design hierarchy 72

design--the art of trial and error 73

design styles 75

design partitioning 76

architecture, methodology, and design flow 76

ic architectures 76

design methodology and design flow 78

tool suites 79

summary 79

quick quiz 80

chapter 5 electronic system-level design tools 83

introduction 84

specification guidelines 84

system-level design tools 84

high-level modeling 86

system-level design languages 86

design space exploration and trade-offs 87

test bench creation 90

other system-level tools 91

hardware/software integration 92

approaches to co-design 94

hardware and software co-design 94

embedded systems 95

real time 96

reliability 96

summary 96

quick quiz 97

chapter 6 front-end design tools 99

introduction 100

design capture tools 100

hardware description languages 103

specialized design tools 106

netlist output 106

design capture checking tools 106

verification tools 107

design verification 107

simulation 108

simulation speed 110

formal verification tools 110

device and circuit simulators 110

timing analysis tools 111

dynamic timing analysis 111

static timing analysis 111

clocks 112

signal timing 112

design for test tools 113

design for test 113

boundary scan 114

built-in self test 114

power-related tools 114

power estimation tools 115

low-power design tools 115

synthesis tools 115

summary 116

quick quiz 117

chapter 7 back-end design tools (physical design) 119

introduction 120

physical layout tools 122

floorplanning tools 122

placement and routing tools 123

layout styles 124

power routing tools 126

design rule check tools 127

extraction and timing analysis tools 128

signal integrity issues 129

signal integrity 129

voltage sensitivity 130

noise margin 130

buffers 130

switching noise 131

electromagnetic interference 131

metal migration 131

thermal design tools 132

manufacturing preparation steps 133

merging operations 133

electrostatic discharge protection 133

mask-making preparations 133

diagnostic and manufacturing tests 134

automatic test pattern generation 135

product engineering tools 135

porting designs to new processes 136

summary 137

quick quiz 139

chapter 8 trends 141

eda design environment trends 142

integrated design suites 142

run-time control tools 142

distributed design 143

system design unks to chip design 143

eda tool trends 144

design closure 144

formal verification 145

design repair 145

design for test 145

design for manufacture (dfm) trends 146

design redundancy 146

chip-to-chip differences 147

mask enhancements 147

system-on-chip and ip trends 148

semiconductor trends 148

performance design issues 149

power and thermal design issues 150

physical design issues 150

new materials and uthography 150

summary 151

appendixa elementary electricity 153

introduction 154

atoms and electrons 154

conductors, insulators, and semiconductors 155

electrical attributes 155

electrical current 155

electrical voltage 156

resistance 157

capacitance 157

inductance 157

direct and alternating current 157

other electrical effects 158

static electricity 158

coupling 158

waves 158

electrical components 158

semiconductor devices 159

appendix b semiconductor manufacturing 161

introduction 162

manufacturing process 162

masks and feature size 164

manufacturing test 164

packaging 165

ic testing 165

process improvements 165

appendix c signals to software 167

introduction 168

transistor circuits 168

analog and digital 169

analog 169

digital 169

analog and digital 169

memory 170

logic 170

signal delay 172

computers 172

software 173

appendix d metrics 175

introduction 176

small numbers 176

large numbers 176

appendix e references 181

conferences 182

organizations 183

standards groups 185

publications 186

eda internet sites 187

universities 187

appendix f ics, ip, and soc 189

the ic industry 190

product design 191

integrated circuit design 191

design handoff 192

design re-use and intellectual property 192

design re-use 192

intellectual property 193

types of ip blocks 193

ip vendor business models 194

ip re-use issues 195

system-on-chip 196

soc issues 198

platforms 199

summary 199

appendix g glossary-terms and acronyms 201

index 229


已确认勘误

次印刷

页码 勘误内容 提交人 修订印次

    • 名称
    • 类型
    • 大小

    光盘服务联系方式: 020-38250260    客服QQ:4006604884

    意见反馈

    14:15

    关闭

    云图客服:

    尊敬的用户,您好!您有任何提议或者建议都可以在此提出来,我们会谦虚地接受任何意见。

    或者您是想咨询:

    用户发送的提问,这种方式就需要有位在线客服来回答用户的问题,这种 就属于对话式的,问题是这种提问是否需要用户登录才能提问

    Video Player
    ×
    Audio Player
    ×
    pdf Player
    ×
    Current View

    看过该图书的还喜欢

    some pictures

    解忧杂货店

    东野圭吾 (作者), 李盈春 (译者)

    loading icon