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Summary:
Publisher Summary 1
The book is subtitled "The physics of liquid metal ion sources and ion optics and their application to focused ion beam technology." The authors identify field ionization sources, explain the physics behind the liquid metal ion source (LMIS), and review charged particle optics for applying the LMIS in a focused ion beam system. Later chapters discuss the interactions of ions with solids, and overview practical procedures for designing deflection systems and mass filters, aligning the beam, and evaluating column performance. Orloff and Utlaut are professors at the University of Maryland and University of Portland, respectively, while Swanson is chairman of the FEI Company in Oregon. Annotation (c) Book News, Inc., Portland, OR (booknews.com)
Publisher Summary 2
In this book, we have attempted to produce a reference on high resolution focused ion beams (FIBs) that will be useful for both the user and the designer of FIB instrumentation. We have included a mix of theory and applications that seemed most useful to us.
The field of FIBs has advanced rapidly since the application of the first field emission ion sources in the early 1970s. The development of the liquid metal ion source (LMIS) in the late 1960s and early 1970s and its application for FIBs in the late 1970s have resulted in a powerful tool for research and for industry. There have been hundreds of papers written on many aspects of LMIS and FIBs, and a useful and informative book on these subjects was published in 1991 by Phil Prewett and Grame Mair. Because there have been so many new applications and uses found for FIBs in the last ten years we felt that it was time for another book on the subject.
目录
INTRODUCTION .......................................................................... 1
1. FIELD IONIZATION SOURCES......................................................... 5
1.1. GAS FIELD IONIZATION SOURCES.............................................. 5
1.2. LIQUID METAL FIELD IONIZATION SOURCES ......................... 1
2. PHYSICS OF LIQUID METAL ION SOURCES.............................. 21
2.1. INTRODUCTION .........................21
2.2. THEORY OF LMIS OPERATION................................... 22
2.3. EARLY EXPERIMENTS ON EMISSION OF IONS FROM LIQUID METALS (PRE-1975).... 23
2.4. ION PRODUCTION.............................. ................... 25
2.5. THEORETICAL DESCRIPTION OF LMIS BEHAVIOR............................... 27
2.6. EXPERIMENTAL STUDIES OF LMIS SHAPE................. 36
2.7. LATER THEORETICAL DEVELOPMENTS: CHARACTERIZATION OF EMISSION............. 37
2.8. LIQUID FLOW CHARACTERISTICS IN THE LMIS........ 41
2.9. THE EFFECT OF SPACE CHARGE ON ION EMISSION AND THE SHAPE OF THE
I-V CHARACTERISTIC........................ ............ 44
2.10. LOW CURRENT EMISSION.................................... 48
2.11. CONCLUSIONS REGARDING LMIS THEORY............... 51
2.12. LMIS EMISSION CHARACTERISTICS.......................... 51
2.13. ELEMENTS AND ALLOYS USED IN LMIS..................... 52
2.14. ENERGY DISTRIBUTIONS................................................52
2.15. ANGULAR INTENSITY AND DISTRIBUTIONS.........................59
2.16. NOISE............................................................. 61
2.17. SOURCE LIFETIME............................................................ 62
2.18. EMITTER FABRICATION AND TESTING METHODS............................ 63
2.19. PROPERTIES OF MATERIALS USED IN LMIS.................................... 66
3. ION OPTICS FOR LMIS...................................................................... 79
3.1. INTRODUCTION................................................................. 79
3.2. OPTICAL PROPERTIES OF THE LMIS............................. 80
3.3. REVIEW OF CHARGED PARTICLE OPTICS................... 83
3.3.1. The Refractive Power of an Electrostatic Lens........ 84
3.3.2. The Paraxial Ray Equation..................................... 86
3.3.3. Application of the Paraxial Ray Equation................ 88
3.4. LENS ABERRATIONS...................................................... 89
3.5. ION FOCUSING SYSTEMS FOR FIELD EMISSION ION SOURCES........................94
3.6. WAVE OPTICS................................................................... 97
3.7. ION OPTICAL FORMALISM AND RESOLUTION ....................................... 107
3.8. SPACECHARGEEFFECTS.............................................. 114
3.9. LIMITS OF RESOLUTION................................................ 115
3.10. FOCUSING SYSTEM DESIGN CONSIDERATIONS.....................................11
4. INTERACTION OF IONS WITH SOLIDS...................................... 123
4.1. INTRODUCTION.............................................................. 123
4.2. ENERGYLOSSES.............................................................. 125
4.2.1. Nuclear Losses....................................................... 125
4.2.2. Electronic Losses................................................... 127
4.3. CHANNELING..................................130
4.4. DAMAGE TO THE SAMPLE..................................133
4.5. SPUTTERING..................................................................... 137
5. PRACTICAL FOCUSED ION BEAM OPTICS AND SYSTEMS........................................ 147
5.1. INTRODUCTION............................................................. 147
5.2. SOURCES.......................................................................... 147
5.3. PRACTICAL FOCUSING OPTICS.................................. 152
5.4. LENS DESIGN.................................................................... 156
5.5. THE DEFLECTION SYSTEM........................................... 157
5.6. E x B MASS FILTER DESIGN...........................................158
5.7. BEAM ALIGNMENT TECHNIQUES.............................. 159
5.8. REALLENSDEFECTS.....................................................161
5.9. MAGNETICFIELDPERTURBATIONS..........................166
5.10. INSULATORSHIELDING.................................................166
5.11. COULOMB BEAM INTERACTIONS................................166
5.12. WAVE OPTICS VS. GEOMETRICAL OPTICS............... 171
5.13. HOW TO EVALUATE THE PERFORMANCE ............... 173
5.14. DETECTORS AND IMAGING.......................................... 184
5.15. ION MICROSCOPY: USING BOTH IONS AND ELECTRONS TO IMAGE...................... 192
5.16. COLLECTING INFORMATION: FORMING GOOD IMAGES.................................. 192
5.17. IMAGING AND MILLING VEXATIONS DUE TO CHARGING................................ 196
6. APPLICATIONS OF FOCUSED ION BEAMS ............................... 205
6.1. INTRODUCTION..............................................................205
6.2. MICRO-MACHINING........................................................ 207
6.3. MAKING A CROSS-SECTION CUT................................ 213
6.4. TEMSAMPLE PREPARATION..................................219
6.5. USING SAMPLE DAMAGE TO ADVANTAGE............. 224
6.6. DEPOSITION OF MATERIALS....................................... 224
6.7. ENHANCED ETCH AND DEPOSITION.......................... 236
6.7.1. Enhanced Etch . ................................. 236
6.7.2. Deposition.............................................................. 238
6.8. SCANNING ION MICROSCOPY (SIM)........................... 245
6.9. MICRO-MILLING COPPER...............................................272
6.10. ACCESS TO DIE CIRCUITRY FROM THE "BACKSIDE"...........................253
6.11. SECONDARY ION MASS SPECTROMETRY (FIB/SIMS): THE EXPLOITATION
OFDESTRUCTION........................................................... 255
6.12. FIB IMPLANTATION........................................................ 267
6.13. FIBLITHOGRAPHY.......................................................... 277
6.14. MICRO-MECHANICAL DEVICES (MEMS)................... 279
APPENDIX 1 ELEMENTS OF THE THEORY OF
FIELD DESORPTION AND IONIZATION.... 291
APPENDIX 2 TABLE OF SPUTTER YIELDS......................... 295
INDEX ........................................................................... 297
ABOUT THE AUTHORS................................................................... 303
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