Electronic waste management /

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作   者:editors, R.E. Hester and R.M. Harrison.

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ISBN:9780854041121

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简介

Electronic waste includes such items as TVs, computers, LCD and plasma displays, and mobile phones, as well as a wide range of household, medical and industrial equipment which are simply discarded as new technologies become available. Huge and growing quantities of waste are discarded every year and this waste contains toxic and carcinogenic compounds which can pose a risk to the environment. However, if handled correctly, electronic waste presents a valuable source of secondary raw materials. This book brings together a group of leading experts in the management of electrical and electronic waste to provide an up-to-date review of the scale of the waste problem, the impact of recent legislation such as the Waste Electrical and Electronic Equipment Directive (WEEE) and the "restriction of the use of certain hazardous substances in electrical and electronic equipment" directive (RoHS), and of current and future methods for treatment, recycling and disposal of this waste. The book discusses these latest directives, examines current worldwide legislation and considers the opportunities and threats posed by this form of waste. While the emphasis is on European practice, comparisons with other countries such as the USA, Japan and China are made. The book deals with the full range of waste management issues, including recycling and recovery of materials, design considerations for waste minimisation, and contains a wide variety of illustrative case studies eg: LCD displays. With detailed and comprehensive coverage of the subject matter it also contains an extensive bibliography with each chapter. Key chapters cover areas such as: -electronic waste -materials -EU directives -landfill and incineration -recycling and recovery -'cradle to grave' design considerations -engineering thermoplastics It is essential reading for all involved with electrical and electronic waste management through its comprehensive review of recent EU legislation and the subsequent impact on manufacturers and users of electronic equipment.

目录

Introduction and Overview
Introduction p. 1
WEEE - The Scale of the Problem p. 4
Legislative Influences on Electronics Recycling p. 4
Producer Responsibility Legislation p. 4
The WEEE Directive p. 6
The RoHS Directive p. 7
Other Examples of Legislation p. 8
Treatment Options for WEEE p. 10
Material Composition of WEEE p. 11
Socio-economic Factors p. 13
Logistics of WEEE p. 15
WEEE - the International Perspective p. 18
European Perspective p. 18
Japan p. 20
Barriers to Recycling of WEEE p. 24
The Recycling Hierarchy and Markets for Recyclate p. 25
WEEE Health and Safety Implications p. 30
Future Factors That May Influence Electronic Waste Management p. 35
Summary and Conclusions p. 37
References and Further Reading p. 37
Materials Used in Manufacturing Electrical and Electronic Products
Perspective p. 40
Impact of Legislation on Materials Used in Electronics p. 40
Overview p. 40
The RoHS Directive and Proscribed Materials p. 42
Where do RoHS Proscribed Materials Occur? p. 44
Lead p. 44
Brominated Flame Retardants p. 44
Cadmium, Mercury and Hexavalent Chromium p. 45
Soldering and the Move to Lead-free Assembly p. 46
Introduction p. 46
Lead-free Solder Choices p. 46
Printed Circuit Board Materials p. 47
Introduction p. 47
PCB Materials p. 48
Provision of Flame Retardancy in PCBs p. 50
Non-ferrous and Precious Metals p. 52
Encapsulants of Electronic Components p. 53
Indium Tin Oxide and LCD Screens p. 54
Polymeric Materials in Enclosures, Casings and Panels p. 55
Product-related Plastic Content p. 55
WEEE Engineering Thermoplastics p. 59
Polycarbonate (PC) p. 59
ABS (Acrylonitrile-Butadiene-Styrene) p. 61
High Impact Polystyrene (HIPS) p. 62
Polyphenyleneoxide (PPO) p. 62
PC/ABS Blends p. 62
Flame Retardants in Engineering Thermoplastics p. 63
Materials Composition of WEEE p. 65
Introduction p. 65
Mobile Phones p. 66
Televisions p. 68
Washing Machines p. 71
Conclusions p. 72
References p. 73
Dumping, Burning and Landfill
Introduction p. 75
England: Site Inputs 2002-2003 p. 77
Waste Inputs to Different Management Options in 2005 p. 77
Landfill p. 77
Historical p. 77
Pollution from Landfills p. 79
Landfill Gas p. 79
Leachate p. 79
Landfill-site Construction p. 80
Burning p. 82
Historical p. 82
Incineration p. 82
Mass Burn p. 82
Energy Recovery/Energy from Waste (EFW) p. 83
Advanced Thermal Processing p. 84
Pollution from Incineration p. 85
Legislation Summary p. 88
Current UK Legislation p. 88
References p. 89
Recycling and Recovery
Introduction p. 91
Separation and Sorting p. 92
Treatment p. 92
Mixed WEEE p. 93
Refrigeration Equipment p. 95
Cathode Ray Tubes p. 96
Individual Processes p. 97
Outputs and Markets p. 102
Metals p. 103
Glass p. 103
Plastics p. 103
Emerging Technologies p. 104
Separation p. 104
Thermal Treatments p. 105
Hydrometallurgical Extraction p. 106
Sensing Technologies p. 106
Plastics to Liquid Fuel p. 107
Plastics Containing Brominated Flame Retardents p. 107
Acknowledgements p. 108
References p. 108
Integrated Approach to e-Waste Recycling
Introduction p. 111
Recycling and Recovery Technologies p. 113
Sorting/Disassembly p. 114
Crushing/Diminution p. 115
Separation p. 115
Emerging Recycling and Recovery Technologies p. 117
Automated Disassembly p. 117
Comminution p. 117
Separation p. 118
Thermal Treatments p. 119
Hydrometallurgical Extraction p. 119
Dry Capture Technologies p. 119
Biotechnological Capture p. 119
Sensing Technologies p. 120
Design for Recycling and Inverse Manufacturing p. 120
Printed Circuit Boards p. 121
Overview p. 121
Recycling p. 124
Current Disposal Hierarchy p. 126
Economics of Recycling p. 127
Future Developments p. 128
Characteristics of PCB Scrap p. 129
Emerging Technologies p. 132
Sector-based Eco-design p. 141
Disassembly p. 142
Fasteners p. 143
RFIDs (Radio Frequency Identification Tags) p. 145
Active Disassembly p. 146
Design Methodology and Resource Efficiency p. 147
Recycling p. 147
Constraints on Materials Selection p. 148
Eco-design Guidelines for Manufacturing p. 150
References p. 160
European Recycling Platform (ERP): a Pan-European Solution to WEEE Compliance
Brief Introduction to WEEE p. 161
The WEEE Directive p. 161
Producer Responsibility p. 162
Household and Non-household WEEE p. 162
Marking EEE Products p. 163
WEEE Collection Points p. 164
Product Categories and Waste Streams p. 164
Producer Compliance Schemes p. 164
Variations in National WEEE Laws p. 164
Introduction to European Recycling Platform (ERP) p. 165
European Recycling Platform p. 165
Founder Members p. 165
Timeline p. 165
Founding Principles p. 166
Structure p. 166
Scope of services p. 168
The Operational Model - General Contractor Approach p. 168
Euro PLUS p. 170
ERP in Operation p. 170
Country Summaries p. 170
Key Performance Indicators p. 170
Members p. 170
ERP - Beyond Compliance p. 172
Implementation of Individual Producer Responsibility (IPR) p. 172
ERP UK WEEE Survey p. 173
Summary p. 175
Key Achievements p. 175
Final Thoughts: Interviews with Two Founding Members p. 177
References p. 179
Liquid Crystal Displays: from Devices to Recycling
Introduction p. 180
Overview of Liquid Crystals p. 183
Definition and Classification of Liquid Crystals p. 184
Molecular and Chemical Architecture of Liquid Crystals p. 185
The Mesophase: Types of Intermediate State of Matter p. 186
Physical Properties of Liquid Crystals and Material Requirements p. 188
Overview of Liquid Crystal Displays Based on Nematic Mesophase p. 190
Basic LCD Operating Principles p. 190
Types of Electro-optic LCD Devices p. 191
LCD Manufacturing Process p. 195
Environmental Legislation and Lifecycle Analysis p. 197
The WEEE Directive and LCDs p. 197
RoHS and REACH p. 199
Far East Environmental Measures p. 199
Lifecycle Analysis p. 199
Potentially Hazardous Constituents: Toxicity of LCD Constituents p. 201
Toxicity of Mercury and Backlighting p. 201
Toxicity of Liquid-crystal Mixture p. 203
Demanufacture and Recycling p. 204
Future Outlook p. 208
LCD Panels p. 208
Smart Disassembly p. 209
Legislation p. 209
References p. 209
The Role of Collective versus Individual Producer Responsibility in e-Waste Management: Key Learnings from Around the World
Introduction p. 212
E-waste and Its Environmental Impacts p. 212
Background to Producer Responsibility p. 213
Defining Individual and Collective Producer Responsibility p. 215
The WEEE Directive in Europe p. 216
The WEEE Directive's Approach to Individual and Collective Producer Responsibility p. 216
Implementation of Individual and Collective Producer Responsibility in the EU p. 218
ICT Milieu, The Netherlands p. 219
E-waste Laws and Voluntary Agreements in Other Countries p. 220
Japanese Electronics Take-back Directive p. 220
Product Take-back in the USA p. 221
Product Stewardship in Australia p. 222
Discussion p. 223
Competition in E-Waste Management p. 223
Collective Producer Responsibility: Benefits and Disadvantages p. 225
Individual Producer Responsibility: Benefits and Disadvantages p. 225
Evaluating Collective versus Individual Producer Responsibility p. 227
Recommendations to Implement IPR p. 230
Recommendation #1: Ensure Article 8.2 of the WEEE Directive is Fully Transposed p. 230
Recommendation #2: Adopt a Phased Approach to IPR p. 231
Recommendation #3: Member States to Implement IPR p. 232
Conclusions p. 233
References p. 234
Rapid Assessment of Electronics Enclosure Plastics
Introduction p. 236
Instrumental Techniques p. 237
Visible-NIR Spectroscopy of Engineering Thermoplastics p. 239
Discrimination of Enclosure Materials p. 241
Base Polymer Identification p. 243
Selected Thermoplastics for Processing p. 244
Controlled Degradation Experiments p. 245
Analysis of Processed Thermoplastics p. 245
Analysis of Plastics Containing Flame-retardant Additives p. 248
Visible-NIR Spectroscopy p. 249
X-Ray Fluorescence and Optical Emission Spectroscopy p. 251
Infrared and Raman Spectroscopy p. 253
Conclusions p. 255
References p. 256
Subject Index p. 258

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